(06-06-2018, 01:56 AM)JonnyH Wrote: [ -> ]To be honest, since SD835 throttling hasn't been a massive issue
Does anyone actually profiled SD845 for throttling? I guess not and I wouldn't take S9 into account due to Samsung's DVFS. From my experience SD835 isn't throttling in Dolphin (Pixel 2 XL, Nokia 8 though both phones have massive heatsinks)
This is a link to a video with a preview of the phone, supposedly it will be a snapdragon 845 overclocked to 2.96 ghz, this will be very interesting to see....
https://www.youtube.com/watch?v=nzN1ADxlNck
90 hz display, 8 gb ram and 512 gb of storage, I got the feeling this phone is gonna be very expensive, also it has an external cooling solution that comes included with the phone.
Asus is notoriously bad with android OS updates, so we will see how it fares.
Interestingly, I can't seem to find any info on how the cooling accessory actually works. My assumption when I first saw the device is that it would channel air into the phone and past fins and out an exhaust port, ala active cooling. But
looking at the images they released, there is something that looks like an exhaust port, but there isn't really a way to channel air for it? And there
isn't really any room for fins in the cooling plate they showed. Worst of all, with the SOC and fan positions it would be suuuuper inefficient, with four 90° turns! With a super weak and small fan, plus all of those bends, I can't imagine it being very effective at all. Alternatively, it's possible there is some metal on metal thermal transfer in the expanded usb port, but it doesn't seem efficient for that either, since there is little metal and the fan is again far from it.
Honestly, it kind of looks like the cooling accessory's primary cooling method is blowing the fan against the back of the phone. Sadly that seems the most efficient method for them with how everything is laid out.
(06-06-2018, 08:00 AM)MayImilae Wrote: [ -> ]Interestingly, I can't seem to find any info on how the cooling accessory actually works. My assumption when I first saw the device is that it would channel air into the phone and past fins and out an exhaust port, ala active cooling. But from looking at the images they released, there is something that looks like an exhaust port, but there isn't really a way to channel air for it? And is there really any room for fins in the cooling plate they showed. Worst of all, with the SOC and fan positions it would be suuuuper inefficient, with four 90° turns! With a super weak and small fan, plus all of those bends, I can't imagine it being very effective at all. Alternatively, it's possible there is some metal on metal thermal transfer in the expanded usb port, but it doesn't seem efficient for that either, since there is little metal and the fan is again far from it.
Honestly, it kind of looks like the cooling accessory's primary cooling method is blowing the fan against the back of the phone. Sadly that seems the most efficient method for them with how everything is laid out.
Could it be possible for them to use the cooling module itself asa means to conduct heat from the main body into the module via metal to metal (assuming the exhaust port is metal), transfer it to a heat sink in the module and then use the fan? Basically an extension of the passive cooling model. Not terribly effective but it *could* be more effective. I’m not an expert in thermal dynamics but running the fan against the body seems extremely low effort as far as cooling models go.
Well, from
seeing it in video form, there is very little metal that is inserted into the phone. It doesn't seem to go any deeper than a typical type c port. And it's only about twice as wide as one. That's very little metal that goes into the phone! So even if the fan was able to make that metal that went into the phone very cool, there isn't that much metal to perform the transfer. There's also the issue that the
SoC is roughly an inch away from that strange side port, so there are also issues getting heat from the SoC into the metal bit for metal on metal heat transfer.
I imagine whenever somebody gets to do a teardown on this one we'll see how they intend on more effectively dissipating heat
Whatever it is, it will probably still be better than Razer’s phone sized heat pipe. At the very least ASUS is willing to compromise aesthetics to get things like an exhaust port and extra cooling potential. Razer tried to convince everyone they could do a super thin phone with a clean industrial body and somehow cool it more.
(06-06-2018, 08:20 AM)MayImilae Wrote: [ -> ]Well, from seeing it in video form, there is very little metal that is inserted into the phone. It doesn't seem to go any deeper than a typical type c port. And it's only about twice as wide as one. That's very little metal that goes into the phone! So even if the fan was able to make that metal that went into the phone very cool, there isn't that much metal to perform the transfer. There's also the issue that the SoC is roughly an inch away from that strange side port, so there are also issues getting heat from the SoC into the metal bit for metal on metal heat transfer.
If you look at 56 seconds into that video it seems there is some space between the back and the backplate where they might be able to tunnel some air through. I guess time will tell.