Dolphin, the GameCube and Wii emulator - Forums

Ahh you mean that thing out of metal, of course I have this ..

Sorry, i meant thermal compounds (may have used wrong terminology), its an adhesive substance that helps keep everything cool, something like Artic cooler MX-4 or Noctua NT-H1

http://www.kitguru.net/wp-content/uploads/2010/09/P1100667.jpg

Image is big, so i'll just leave a link

Some months ago I bought the Mugen3, but the fan broke down a week ago, so I bought a new one .. It looks like the broken one, but it has 2000 rotations per second, the old one had 1600 ..

Mugen 3:
http://rwlabs.com/images/articles/scythe/mugen_3/mugen3a.jpg

It's cooling better than before, when Dolphin is running on regular 2.8 GHz or Turbo-Mode it only gets 40 to 45 C° ..

(10-31-2012, 04:09 AM)Zee530 Wrote: [ -> ]Sorry, i meant thermal compounds (may have used wrong terminology), its an adhesive substance that helps keep everything cool, something like Artic cooler MX-4 or Noctua NT-H1

http://www.kitguru.net/wp-content/uploads/2010/09/P1100667.jpg

Image is big, so i'll just leave a link

He just had to use the menu in my link
[attachment=8404]

(10-31-2012, 04:17 AM)LordVador Wrote: [ -> ]

(10-31-2012, 04:09 AM)Zee530 Wrote: [ -> ]Sorry, i meant thermal compounds (may have used wrong terminology), its an adhesive substance that helps keep everything cool, something like Artic cooler MX-4 or Noctua NT-H1

http://www.kitguru.net/wp-content/uploads/2010/09/P1100667.jpg

Image is big, so i'll just leave a link

He just had to use the menu in my link

Oh, I missed that

Proper terminology (please use it):

Heatsink: The big metal thing
Fan: A mechanical component used to produce airflow.
HSF: Stands for heatsink + fan
Thermal grease: Also called thermal gel, thermal compound, thermal paste, TIM (thermal interface material), heat paste, heat sink paste, heat sink compound, etc. The fluid that you spread over the surface of the cpu and/or the bottom of the heatsink
Thermal adhesive: NOT THE SAME THING AS THERMAL GREASE! A thermally conductive glue. It is a glue, not a paste or grease. Once it hardens you can't get it off. It typically doesn't conduct heat anywhere near as well as thermal compound.
Heatspreader: The aluminum plate covering your cpu that you pour the thermal grease onto.
Air cooler: An informal name for an HSF. This may be confusing since home air conditioning units are sometimes referred to as "air coolers" as well.
Coolant: HSFs don't have coolant. Coolant is a liquid that transports heat through a cooling system. For example the water inside a liquid cooling system would be the coolant inside that system.

I won't even touch on the rest of the nonsense in this thread right now (maybe later though) since most of it boils down to the urban myth that your computer is going to blow up if you try to OC your cpu without having a deep understanding of electronic engineering.

(10-31-2012, 09:39 AM)NaturalViolence Wrote: [ -> ]Coolant: HSFs don't have coolant.

Well that's a stupid thing to say. They don't work in a vacuum. Why? There's no air to act as a coolant.

The word coolant is usually only used to refer to liquids but technically you're right.

(10-31-2012, 11:54 AM)NaturalViolence Wrote: [ -> ]The word coolant is usually only used to refer to liquids but technically you're right.

For a technical guy who loves his terminology so much I would think you would say you're entirely right.

Fine. He's entirely right. Happy now?