Yes you can, but you need to have a good feeling of how much pressure is needed for good contact - so it's not as fool proof as with a heatspreader.
On some older CPUs like the Pentium3 or Athlon Thunderbird the heatsink was put direct ontop of the die.
The Intel Whitepaper also tells something about "improved packaging material" - maybe this will have some positive effect.
But we will see...
On some older CPUs like the Pentium3 or Athlon Thunderbird the heatsink was put direct ontop of the die.
The Intel Whitepaper also tells something about "improved packaging material" - maybe this will have some positive effect.
But we will see...