(09-04-2014, 06:25 PM)Rikimaru Wrote: It is not very simple. It needs sizeable investment.
Pics you provided just show smaller package, not chip die area. As I said I need pics without heatspreader.
They added cache coherency protocol. It does not add new instructions for software to use.
Well, is it simpler than making a whole new CPU on the smaller fab size?
Would you rather have a picture of the CPU die itself? Like so?: https://marcan.st/transf/broadway_annotated.jpg
Because its either the heatspreader on or that, and no one spent the time to do a comparison of the old and new without heat spreader that I've been able to find :/
Ok, that makes sense