Delidding is a lot harder than it sounds, and a lidded 4690K is likely to OC better than a delidded 4670K.
A lidded 4670K has a small area of thick TIM paste to carry heat to the IHS, which has a large area to transfer heat to where it needs to go.
A delidded 4670K has a small area of thin TIM paste to carry heat straight to the heat sync, which is better mostly because the bottlenecking paste is a thinner layer.
A lidded 4690K has a small area of extremely conductive solder to carry heat to the IHS, which has a large area to transfer heat to where it needs to go. In this situation, the bottleneck is moved back to the large area of the IHS, as thr IHS and the chip are effectively the same piece of metal.
A lidded 4670K has a small area of thick TIM paste to carry heat to the IHS, which has a large area to transfer heat to where it needs to go.
A delidded 4670K has a small area of thin TIM paste to carry heat straight to the heat sync, which is better mostly because the bottlenecking paste is a thinner layer.
A lidded 4690K has a small area of extremely conductive solder to carry heat to the IHS, which has a large area to transfer heat to where it needs to go. In this situation, the bottleneck is moved back to the large area of the IHS, as thr IHS and the chip are effectively the same piece of metal.
OS: Windows 10 64 bit Professional
CPU: AMD Ryzen 5900X
RAM: 16GB
GPU: Radeon Vega 56
CPU: AMD Ryzen 5900X
RAM: 16GB
GPU: Radeon Vega 56